One Part, 85˚C Curing Epoxy for Chip Coating Applications

Master Bond Supreme 3CCM-85 is a toughened, one part epoxy system that is not premixed and frozen and features an unlimited working life at room temperature. It has a viscosity and flow profile that is well suited for glob top…

One Part, 85˚C Curing Epoxy for Chip Coating Applications

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Master Bond Supreme 3CCM-85 is a toughened, one part epoxy system that is not premixed and frozen and features an unlimited working life at room temperature. It has a viscosity and flow profile that is well suited for glob top and other encapsulation applications.

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